FormFactor unveils addition to wire-bond logic probe-card family
Test & Measurement
Offering scalability down to a 40-micron pad pitch, the TrueScale PP40 wafer probe card is designed to enable high-efficiency and high parallelism wafer probing on advanced wire-bond logic and SOC devices.
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Commodities giant's high-wire act
CNN Money
You might assume the commodities boom has been an unalloyed good for Bunge, a nearly 200-year-old agriculture-industry titan with $38 billion in sales. The company, whose name is pronounced with a hard 'g' (BUNG-ee), is relatively unknown but has long been among the world's largest soybean crushers and a giant producer of fertilizer. Think of it as a sort of Archer Daniels Midland without the ubiquitous public TV advertisements.
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Viscom's AOI system examines fine wire diameters
Test & Measurement
The S6053BO-V automatic optical inspection system from Viscom is equipped with a universal, high-resolution VHR camera module that enables the system to carry out inspections down to a resolution of 2 µm to 5 µm per pixel.
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