IBM, Rohm and Haas to develop 32-nm and below implant technology
EDN
To facilitate semiconductor implant at and below the 32 nm semiconductor manufacturing process node, IBM Corp and Marlborough, Mass.-based advanced semiconductor lithography materials supplier Rohm and Haas Electronic Materials have entered into a joint development agreement to create patterning materials and processes.
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IBM, Rohm and Haas expand partnership to include 32-, 22-nm copper CMP
EDN
To bolster high volume manufacturing of the 32- and 22-nm semiconductor manufacturing process nodes, IBM Corp and the Phoenix, Ariz.-based chemical mechanical planarization (CMP) technologies division of Rohm and Haas Electronic Materials said today they will work together on CMP process development for the integration of copper and low-k dielectrics.
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